Tin

POST-TRANSITION METAL · GROUP 14 · PERIOD 5
50
Sn
Tin
118.71

Atomic Data

Atomic Number50
SymbolSn
Atomic Weight118.71 u
Density (STP)7.287 g/cm³
Melting Point231.93 °C (505.08 K)
Boiling Point2601.85 °C (2875 K)
Electronegativity1.96 (Pauling)
Electron Config.1s2 2s2 2p6 3s2 3p6 3d10 4s2 4p6 4d10 5s2 5p2
Oxidation States+2, +4
Phase at STPSolid
CategoryPost-Transition Metal
Period / Group5 / 14
CAS Number7440-31-5

Electron Configuration

[Kr] 4d10 5s2 5p2

Shell n Subshell Electrons Cumulative
K11s22
L22s24
L22p610
M33s212
M33p618
M33d1028
N44s230
N44p636
N44d1046
O55s248
O55p250
Total 50 50

Isotopes of Tin

Tin has ten naturally occurring stable isotopes. The most abundant is ¹²⁰Sn, comprising 32.58% of all naturally occurring Tin.

Isotope Symbol Protons Neutrons Abundance Stability
Tin-112¹¹²Sn50620.97Stable
Tin-114¹¹⁴Sn50640.66Stable
Tin-115¹¹⁵Sn50650.34Stable
Tin-116¹¹⁶Sn506614.54Stable
Tin-117¹¹⁷Sn50677.68Stable
Tin-118¹¹⁸Sn506824.22Stable
Tin-119¹¹⁹Sn50698.59Stable
Tin-120¹²⁰Sn507032.58Stable
Tin-122¹²²Sn50724.63Stable
Tin-124¹²⁴Sn50745.79Stable

Abundance & Occurrence

Tin is present in Earth's crust at approximately 2.3 ppm by mass and at approximately 4 ppm by mass throughout the universe.

Earth's Crust (ppm by mass)

Tin
2.3 ppm
Silicon (ref.)
277,000 ppm
Oxygen (ref.)
461,000 ppm

Universe (ppm by mass)

Tin
4 ppm
Helium (ref.)
230,000 ppm
Hydrogen (ref.)
739,000 ppm

Discovery & History

~3500 BCE
Near Eastern metallurgists: Tin-bronze alloys: produced by smelting copper with cassiterite (SnO2): first appeared in the Near East, creating a material harder and more durable than pure copper and inaugurating the Bronze Age.
~2000 BCE
Ancient traders: Long-distance tin trade routes connected the mines of Cornwall (England), Afghanistan, and Anatolia, making tin one of the first metals exchanged across continents and driving early complex societies to develop maritime commerce.
1810
Peter Durand: British merchant Peter Durand patented the tin-plated steel food can, exploiting tin's corrosion resistance and non-toxicity to preserve food for months; the innovation transformed military logistics, exploration, and eventually everyday food supply chains worldwide.
1839
Isaac Babbitt: American inventor Isaac Babbitt developed Babbitt metal, a tin-based alloy used in machine bearings that dramatically reduced friction in steam engines and factory machinery, accelerating the industrial revolution.

Safety & Handling

  • Organotin compounds: highly toxic: Organotins such as tributyltin (TBT) and trimethyltin are acutely neurotoxic and endocrine-disrupting; TBT in antifouling marine paint caused widespread ecological damage and is now globally restricted.
  • Tin oxide dust: SnO2 dust causes stannosis, a benign pneumoconiosis that is radiologically visible but does not cause significant lung function impairment at normal exposure levels.
  • Tin pest: Below 13.2 °C, tin metal undergoes allotropic transformation to grey tin ('tin pest'), crumbling to powder; this is historically significant but not a safety hazard under normal conditions.
  • Soldering fumes: Soldering with tin-lead or tin-silver alloys generates flux fumes; rosin flux fumes are respiratory sensitisers and can cause occupational asthma: ensure extraction ventilation at all soldering stations.

Real-World Uses

  • Food can linings (tinplate): Electrolytically tinned steel sheet (tinplate) is the substrate for food and beverage cans; the thin tin coating prevents corrosion of the steel and avoids any taste contamination of canned food.
  • Solder alloys: Tin-silver-copper (SAC) and other tin-based lead-free solders are used throughout the electronics industry to form reliable electrical and mechanical joints on printed circuit boards following the RoHS restriction on lead.
  • Bronze and pewter: Tin alloyed with copper produces bronze (used in bearings, bells, sculptures, and historical artefacts), while tin-antimony-copper pewter alloys are used for tableware, decorative figurines, and ecclesiastical items.
  • Flat glass manufacture: The float glass process, which produces all modern flat glass for windows and mirrors, involves floating molten glass on a bath of molten tin to produce a perfectly flat, polished surface.
  • Organotin stabilisers: Dibutyltin and dioctyltin compounds are heat and UV stabilisers in PVC pipes and window profiles; they prevent thermal degradation of PVC during processing and long-term outdoor service.

Downloadable Resources

Free periodic table reference sheets for classrooms, study sessions, and laboratory use.

Frequently Asked Questions

What is tin used for?

Tin is best known historically as a component of bronze (tin-copper alloy) and pewter. Today its main uses are in solder (tin-lead or lead-free tin alloys used in electronics), tin plating of steel (for food cans: 'tin cans' are steel cans with a thin tin coating), and in organotin compounds used as PVC stabilisers and biocides. Tin is also used in window glass production (the float glass process uses a bath of molten tin).

What is tin pest?

Tin pest is a phase transformation in which white tin (beta-tin, the familiar shiny metal) converts to grey tin (alpha-tin, a powdery crumbling form) at temperatures below 13.2 °C. The transformation is autocatalytic: grey tin spreads from nucleation sites like a disease. Napoleon's army's retreat from Russia in 1812 may have been partly worsened by tin pest causing soldiers' tin coat buttons to crumble in the extreme cold.

How was tin discovered?

Tin is one of the oldest metals known to humanity. Tin artefacts date to around 3500 BCE, and bronze (tin-copper alloy) was so important it defined a prehistoric age. Tin was obtained primarily from cassiterite (SnO2) mined in Cornwall (Britain), Iberia, and later Southeast Asia. The chemical symbol Sn comes from the Latin 'stannum'.

What are lead-free solders and why do they use tin?

Lead-free solders, mandated in most consumer electronics by the EU RoHS directive from 2006, are primarily alloys of tin with silver, copper, bismuth, or other metals. Tin is the base because it has the right melting range for electronics assembly, good wettability on copper, and is not toxic like lead. The most common lead-free solder, SAC305 (96.5% Sn, 3% Ag, 0.5% Cu), has a melting point of about 217–220 °C.